The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2014

Filed:

Jun. 22, 2011
Applicants:

Thorbjörn Ebefors, Huddinge, SE;

Edvard Kälvesten, Hägersten, SE;

Peter Agren, Huddinge, SE;

Niklas Svedin, Stockholm, SE;

Thomas Ericson, Hägersten, SE;

Inventors:

Thorbjörn Ebefors, Huddinge, SE;

Edvard Kälvesten, Hägersten, SE;

Peter Agren, Huddinge, SE;

Niklas Svedin, Stockholm, SE;

Thomas Ericson, Hägersten, SE;

Assignee:

Silex Microsystems AB, Jarfalla, SE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 26/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A layered micro-electronic and/or micro-mechanic structure comprises at least three alternating electrically conductive layers with insulating layers between the conductive layers. There is also provided a via in a first outer layer, said via comprising an insulated conductive connection made of wafer native material through the layer, an electrically conductive plug extending through the other layers and into said via in the first outer layer in order to provide conductivity through the layers, and an insulating enclosure surrounding said conductive plug in at least one selected layer of said other layers for insulating said plug from the material in said selected layer. It also relates to micro-electronic and/or micro-mechanic device comprising a movable member provided above a cavity such that it is movable in at least one direction. The device has a layered structure according to the invention. Methods of making such a layered MEMS structure is also provided.


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