The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2014
Filed:
Apr. 21, 2011
Yasuo Tane, Mie-ken, JP;
Yukio Katamura, Mie-ken, JP;
Atsushi Yoshimura, Kanagawa-ken, JP;
Fumihiro Iwami, Kanagawa-ken, JP;
Kazuyoshi Sakurai, Saitama-ken, JP;
Yasuo Tane, Mie-ken, JP;
Yukio Katamura, Mie-ken, JP;
Atsushi Yoshimura, Kanagawa-ken, JP;
Fumihiro Iwami, Kanagawa-ken, JP;
Kazuyoshi Sakurai, Saitama-ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
KYOCERA Chemical Corporation, Kawaguchi-shi, JP;
Abstract
According to one embodiment, a method is disclosed for manufacturing a semiconductor device. The method can include die bonding to bond a semiconductor element to a first position of a base member via a bonding layer provided on one surface of the semiconductor element. The method can include wire bonding to connect a terminal formed on the semiconductor element to a terminal formed on the base member by a bonding wire. In addition, the method can include sealing to seal the semiconductor element and the bonding wire. Viscosity of the bonding layer in the bonding is controlled not to exceed the viscosity of the bonding layer in the sealing.