The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2014

Filed:

Mar. 26, 2008
Applicants:

Youngmin Kim, Ichon-si, KR;

Baeyong Kim, Seoul, KR;

Hyunchul Kang, Ichon-si, KR;

Inventors:

YoungMin Kim, Ichon-si, KR;

BaeYong Kim, Seoul, KR;

HyunChul Kang, Ichon-si, KR;

Assignee:

STATS Chippac Ltd, Singapore, SG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A mock bump system includes providing a flip chip integrated circuit having an edge and forming a mock bump near the edge.


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