The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2014

Filed:

Sep. 14, 2012
Applicants:

Chien-kai Chung, Hsinchu, TW;

Ta-cheng Hsu, Hsinchu, TW;

Jung-min Hwang, Hsinchu, TW;

Min-hsun Hsieh, Hsinchu, TW;

Ya-lan Yang, Hsinchu, TW;

De-shan Kuo, Hsinchu, TW;

Tsun-kai Ko, Hsinchu, TW;

Chien-fu Shen, Hsinchu, TW;

Ting-chia Ko, Hsinchu, TW;

Schang-jing Hon, Hsinchu, TW;

Inventors:

Chien-Kai Chung, Hsinchu, TW;

Ta-Cheng Hsu, Hsinchu, TW;

Jung-Min Hwang, Hsinchu, TW;

Min-Hsun Hsieh, Hsinchu, TW;

Ya-Lan Yang, Hsinchu, TW;

De-Shan Kuo, Hsinchu, TW;

Tsun-Kai Ko, Hsinchu, TW;

Chien-Fu Shen, Hsinchu, TW;

Ting-Chia Ko, Hsinchu, TW;

Schang-Jing Hon, Hsinchu, TW;

Assignee:

Epistar Corporation, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a light-emitting device comprising the steps of cutting a substrate by a laser beam to form a cavity in the substrate and generate a by-product directly on the substrate by the cutting, and removing the by-product by a chemical solution containing an acid under a predetermined cleaning temperature.


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