The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2014
Filed:
Aug. 13, 2012
Thomas W. Dyer, Pleasant Valley, NY (US);
Tze-man Ko, Hopewell Junction, NY (US);
Yiheng Xu, Hopewell Junction, NY (US);
Shaoning Yao, Wappingers Falls, NY (US);
Thomas W. Dyer, Pleasant Valley, NY (US);
Tze-Man Ko, Hopewell Junction, NY (US);
Yiheng Xu, Hopewell Junction, NY (US);
Shaoning Yao, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A test structure and method for monitoring process uniformity. Embodiments of the invention include test structures having a first metallization layer, a second metallization layer formed above the first metallization layer, a defect-generating region in a first metallization layer, a defect-dispersing region in the second metallization layer above the defect-generating region; and a defect-detecting region in the second metallization layer adjacent to the defect-dispersing region. The defect-generating region of the exemplary embodiment may have zero pattern density, uniform non-zero pattern density, or non-uniform non-zero pattern density. The defect-detecting region may include a test pattern such as, a comb-serpentine structure. Embodiments may include more than one defect-generating region, more than one defect-dispersing region, or more than one defect-detecting region. Embodiments may further include methods of manufacturing said test structures and methods of utilizing said test structures to monitor back end processes and determine if such processes are within specification limits.