The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2014
Filed:
Sep. 27, 2010
William Thie, Mountain View, CA (US);
John M. Boyd, Hillsboro, CA (US);
Yezdi Dordi, Palo Alto, CA (US);
Fritz C. Redeker, Fremont, CA (US);
William Thie, Mountain View, CA (US);
John M. Boyd, Hillsboro, CA (US);
Yezdi Dordi, Palo Alto, CA (US);
Fritz C. Redeker, Fremont, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
An electroless plating system is provided. The system includes a first vacuum chuck supporting a first wafer and a second vacuum chuck supporting a second wafer such that a top surface of the second wafer is opposing a top surface of the first wafer. The system also includes a fluid delivery system configured to deliver a plating solution to the top surface of the first wafer, wherein in response to delivery of the plating solution, the top surface of the second wafer is brought proximate to the top surface of the first wafer so that the plating solution contacts both top surfaces. A method for applying an electroless plating solution to a substrate is also provided.