The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2013

Filed:

Aug. 27, 2012
Applicants:

Ralf Otremba, Kaufbeuren, DE;

Marco Seibt, Villach, AT;

Uwe Kirchner, Feldkirchen, AT;

Wolfgang Peinhopf, Viktring, AT;

Michael Treu, Villach, AT;

Andreas Schloegl, Ottobrunn, DE;

Mario Veldvoss, Munich, DE;

Inventors:

Ralf Otremba, Kaufbeuren, DE;

Marco Seibt, Villach, AT;

Uwe Kirchner, Feldkirchen, AT;

Wolfgang Peinhopf, Viktring, AT;

Michael Treu, Villach, AT;

Andreas Schloegl, Ottobrunn, DE;

Mario Veldvoss, Munich, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.


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