The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2013
Filed:
Mar. 22, 2012
Aditi Chandra, Los Gatos, CA (US);
Arvind Kamath, Los Altos, CA (US);
James Montague Cleeves, Redwood City, CA (US);
Joerg Rockenberger, San Jose, CA (US);
Mao Takashima, Cupertino, CA (US);
Erik Scher, San Francisco, CA (US);
Aditi Chandra, Los Gatos, CA (US);
Arvind Kamath, Los Altos, CA (US);
James Montague Cleeves, Redwood City, CA (US);
Joerg Rockenberger, San Jose, CA (US);
Mao Takashima, Cupertino, CA (US);
Erik Scher, San Francisco, CA (US);
Kovio, Inc., San Jose, CA (US);
Abstract
Methods of forming contacts (and optionally, local interconnects) using an ink comprising a silicide-forming metal, electrical devices such as diodes and/or transistors including such contacts and (optional) local interconnects, and methods for forming such devices are disclosed. Electrical devices, such as diodes and transistors may be made using such printed contact and/or local interconnects. A metal ink may be printed for contacts as well as for local interconnects at the same time, or in the alternative, the printed metal can act as a seed for electroless deposition of other metals if different metals are desired for the contact and the interconnect lines. This approach advantageously reduces the number of processing steps and does not necessarily require any etching.