The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2013
Filed:
Dec. 16, 2011
Wei-hsiang Tseng, Park Hsinchu, TW;
Jui-chun Peng, Hsinchu, TW;
Kai-fa Ho, New Taipei, TW;
Ho-ping Chen, Park Hsinchu, TW;
Chia-yun Lee, Zhunan Township, Miaoli County, TW;
Wei-Hsiang Tseng, Park Hsinchu, TW;
Jui-Chun Peng, Hsinchu, TW;
Kai-Fa Ho, New Taipei, TW;
Ho-Ping Chen, Park Hsinchu, TW;
Chia-Yun Lee, Zhunan Township, Miaoli County, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
The present disclosure relates to a wafer chuck configured to provide a uniform photoresist layer on a workpiece. In some embodiments, the wafer chuck comprises a plurality of vacuum holes. The plurality of vacuum holes (i.e., more than one) are in fluid communication with a cavity that continuously extends along the top surface between the vacuum holes. A vacuum source, connected to each vacuum hole, is configured to remove gas molecules from the cavity located below the workpiece leaving behind a low pressure vacuum. The use of a plurality of vacuum holes increase the uniformity of the vacuum, thereby preventing the formation of high vacuum areas in close proximity to any specific vacuum hole. The reduction of high vacuum areas reduces wafer bending associated with the high vacuum areas.