The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2013

Filed:

Jan. 11, 2012
Applicant:

Hsien-chang Chang, Tainan, TW;

Inventor:

Hsien-Chang Chang, Tainan, TW;

Assignee:

United Microelectronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method scales down an integrated circuit layout structure without substantially jeopardizing electronic characteristics of devices. First, a conductive line set includes a first conductive line and a second conductive line respectively passing through a first region and a second region. Second, a sizing-down operation is performed so that the first conductive line and the second conductive line respectively have a first region scaled-down line width, a first region scaled-down space and a first region scaled-down pitch in the first region as well as selectively have a second region original line width, a second region scaled-down space and a second region scaled-down pitch in the second region. The first region scaled-down line width and the second region original line width are substantially different from each other.


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