The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2013
Filed:
Oct. 11, 2006
Feng-hsu Fan, Jhonghe, TW;
Trung Tri Doan, Baoshan Township, TW;
Chuong Anh Tran, Baoshan Township, Hsinchu County, TW;
Chen-fu Chu, Hsinchu, TW;
Chao-chen Cheng, Hsinchu, TW;
Jiunn-yi Chu, Chubei, TW;
Wen-huang Liu, Guan-Xi Town, TW;
Hao-chun Cheng, Donggang Township, Pingtung County, TW;
Jui-kang Yen, Taipei, TW;
Feng-Hsu Fan, Jhonghe, TW;
Trung Tri Doan, Baoshan Township, TW;
Chuong Anh Tran, Baoshan Township, Hsinchu County, TW;
Chen-Fu Chu, Hsinchu, TW;
Chao-Chen Cheng, Hsinchu, TW;
Jiunn-Yi Chu, Chubei, TW;
Wen-Huang Liu, Guan-Xi Town, TW;
Hao-Chun Cheng, Donggang Township, Pingtung County, TW;
Jui-Kang Yen, Taipei, TW;
SemiLEDs Optoelectronics Co., Ltd., Miao-Li County, TW;
Abstract
Techniques for fabricating metal devices, such as vertical light-emitting diode (VLED) devices, power devices, laser diodes, and vertical cavity surface emitting laser devices, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, the invention discloses techniques in the fabrication arts that are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non- (or low) thermally conductive and/or non- (or low) electrically conductive carrier substrate that has been removed.