The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2013
Filed:
Sep. 05, 2006
Applicants:
Kai Chong Chan, Singapore, SG;
Gerald Ofner, Singapore, SG;
Inventors:
Kai Chong Chan, Singapore, SG;
Gerald Ofner, Singapore, SG;
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device () for radio frequency applications has a semiconductor chip () with an integrated circuit accommodated in a radio frequency package. Inside bumps () comprise inside contacts between the semiconductor chip () and a redistribution substrate (). The inside bumps () have a metallic or plastic core () and a coating layer () of a noble metal.