The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2013

Filed:

Mar. 21, 2011
Applicants:

Bonghwan Han, Icheon, KR;

Tae Kyu Choi, Icheon, KR;

Seungjoo Kwak, Hwasung, KR;

Dongwon Son, Icheon, KR;

Gyung Sik Yun, Young-in, KR;

Inventors:

BongHwan Han, Icheon, KR;

Tae Kyu Choi, Icheon, KR;

SeungJoo Kwak, Hwasung, KR;

DongWon Son, Icheon, KR;

Gyung Sik Yun, Young-in, KR;

Assignee:

STATS ChipPAC Ltd., Singapore, SG;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a carrier top side; mounting an integrated circuit over the carrier top side; attaching a bottom attachment directly on the integrated circuit; dragging a sandwich connector from the bottom attachment, the sandwich connector having a connector diameter; and attaching a top attachment directly on the sandwich connector, the top attachment wider than the bottom attachment.


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