The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2013
Filed:
Mar. 19, 2008
Applicants:
OH Han Kim, Icheon, KR;
Kyung Moon Kim, Youngin-si, KR;
Inventors:
Oh Han Kim, Icheon, KR;
Kyung Moon Kim, Youngin-si, KR;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A flip chip interconnection system includes: providing a conductive lead coated with a protective coating; forming a groove through the protective coating to the conductive lead for controlling solder position on a portion of the conductive lead; and attaching a flip chip having a solderable conductive interconnect to the portion of the conductive lead.
Kim, Oh. (2013). Flip chip interconnection system having solder position control mechanism (U.S. Patent No. 8604624). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8604624
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile