The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2013
Filed:
Dec. 27, 2010
Tsutomu Ogihara, Jyoetsu, JP;
Takeru Watanabe, Jyoetsu, JP;
Takeshi Kinsho, Jyoetsu, JP;
Katsuya Takemura, Jyoetsu, JP;
Toshihiko Fujii, Jyoetsu, JP;
Daisuke Kori, Jyoetsu, JP;
Tsutomu Ogihara, Jyoetsu, JP;
Takeru Watanabe, Jyoetsu, JP;
Takeshi Kinsho, Jyoetsu, JP;
Katsuya Takemura, Jyoetsu, JP;
Toshihiko Fujii, Jyoetsu, JP;
Daisuke Kori, Jyoetsu, JP;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Abstract
There is disclosed a resist underlayer film-forming composition comprising, at least: a resin (A) obtained by condensing a compound represented by the following general formula (1) with a compound represented by the following general formula (2) by the aid of an acid catalyst; a compound (B) represented by the general formula (1); a fullerene compound (C); and an organic solvent. There can be a resist underlayer film composition in a multi-layer resist film to be used in lithography, which underlayer film is excellent in property for filling up a height difference of a substrate, possesses a solvent resistance, and is not only capable of preventing occurrence of twisting during etching of a substrate, but also capable of providing an excellently decreased pattern roughness; a process for forming a resist underlayer film by using the composition; and a patterning process.