The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2013
Filed:
Aug. 26, 2010
Meng-yi Shen, Yunlin County, TW;
Liang-yu HU, Hsinchu County, TW;
Tsung-hsuan Ho, Hsinchu County, TW;
Sheng-i Tseng, Hsinchu, TW;
Meng-Yi Shen, Yunlin County, TW;
Liang-Yu Hu, Hsinchu County, TW;
Tsung-Hsuan Ho, Hsinchu County, TW;
Sheng-I Tseng, Hsinchu, TW;
Mcronix International Co., Ltd., Hsin-chu, TW;
Abstract
A chemical mechanical polishing method is provided. The chemical mechanical polishing method includes steps of providing a plurality of semiconductor elements to be polished, obtaining a respective dimension of the each semiconductor element to be polished, and polishing the each semiconductor element according to the respective dimension thereof.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile