The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2013

Filed:

Jan. 08, 2010
Applicants:

Satish Sundar, Bangalore, IN;

Jeffrey C. Hudgens, San Francisco, CA (US);

Prudhvi R. Chintalapati, Milpitas, CA (US);

William Nixon Taylor, Jr., Dublin, CA (US);

William P. Laceky, Georgetown, TX (US);

Jeffrey A. Brodine, Los Gatos, CA (US);

Dean C. Hruzek, Austin, TX (US);

Mario Dave Silvetti, Morgan Hill, CA (US);

Inventors:

Satish Sundar, Bangalore, IN;

Jeffrey C. Hudgens, San Francisco, CA (US);

Prudhvi R. Chintalapati, Milpitas, CA (US);

William Nixon Taylor, Jr., Dublin, CA (US);

William P. Laceky, Georgetown, TX (US);

Jeffrey A. Brodine, Los Gatos, CA (US);

Dean C. Hruzek, Austin, TX (US);

Mario Dave Silvetti, Morgan Hill, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01L 21/6831 (2013.01); H01L 21/683 (2013.01); H01L 21/67 (2013.01); H01L 21/673 (2013.01); H01L 21/677 (2013.01); Y10S 414/141 (2013.01); Y10S 901/30 (2013.01); Y10S 901/40 (2013.01);
Abstract

Systems, apparatus and methods for transporting substrates between system components of an electronic device manufacturing system are provided. The systems and apparatus include an electrostatic end effector having a base, an electrode pair on the base, and spacer members for spacing the substrate from the electrode pairs to provide a gap between the electrode pair and the substrate. Methods of the invention as well as numerous other aspects are provided.


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