The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2013

Filed:

Sep. 28, 2007
Applicants:

Toshio Komiyatani, Akita, JP;

Takashi Hirano, Tokyo, JP;

Kenzou Maejima, Tokyo, JP;

Satoru Katsurayama, Tokyo, JP;

Tomoe Yamashiro, Tokyo, JP;

Inventors:

Toshio Komiyatani, Akita, JP;

Takashi Hirano, Tokyo, JP;

Kenzou Maejima, Tokyo, JP;

Satoru Katsurayama, Tokyo, JP;

Tomoe Yamashiro, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/00 (2006.01); C09J 113/00 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides an adhesive tape comprising a flux-active compound having a carboxyl group and/or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In the adhesive tape of the present invention, the thermosetting resin may be an epoxy resin and may contain a curing agent. The curing agent may be an imidazole compound and/or a phosphorous compound. The adhesive tape of the present invention can be used as an interlayer material for a circuit board and a multilayered flexible printed circuit board.


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