The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2013

Filed:

Jun. 15, 2009
Applicants:

Keisuke Kishimoto, Yokohama, JP;

Satoshi Ibe, Yokohama, JP;

Takuya Hatsui, Tokyo, JP;

Shimpei Otaka, Kawasaki, JP;

Hiroto Komiyama, Tokyo, JP;

Hiroyuki Morimoto, Tokyo, JP;

Masahiko Kubota, Tokyo, JP;

Toshiyasu Sakai, Kawasaki, JP;

Inventors:

Keisuke Kishimoto, Yokohama, JP;

Satoshi Ibe, Yokohama, JP;

Takuya Hatsui, Tokyo, JP;

Shimpei Otaka, Kawasaki, JP;

Hiroto Komiyama, Tokyo, JP;

Hiroyuki Morimoto, Tokyo, JP;

Masahiko Kubota, Tokyo, JP;

Toshiyasu Sakai, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01D 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for processing a substrate includes preparing a substrate having a first layer on a first surface side thereof, the first layer having a material capable of suppressing transmission of laser light, processing the substrate with laser light from a second surface that is opposite the first surface of the substrate toward the first surface of the substrate, and allowing the laser light to reach the first layer to form a hole in the substrate, and performing etching of the substrate from the second surface through the hole.


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