The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2013
Filed:
Feb. 29, 2012
Tsutomu Yamauchi, Ogaki, JP;
Satoru Kawai, Ogaki, JP;
Tsutomu Yamauchi, Ogaki, JP;
Satoru Kawai, Ogaki, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A method for manufacturing a printed wiring board includes preparing a core substrate having first and second surfaces, forming a penetrating hole from the first surface toward the second surface of the substrate, forming first conductor on the first surface of the substrate, forming second conductor on the second surface of the substrate, and filling conductive material in the hole such that through-hole conductor connecting the first and second conductors is formed. The forming of the hole includes forming a first opening portion on the first-surface side of the substrate, a second opening portion from the bottom of the first portion toward the second surface, and a third opening portion from the bottom of the second portion toward the second surface, and the forming of the hole satisfies X<X≦Xwhere X, Xand Xrepresent the diameters of the first, second and third portions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile