The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2013

Filed:

Dec. 30, 2010
Applicant:

Rung-an Chen, Taipei Hsien, TW;

Inventor:

Rung-An Chen, Taipei Hsien, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); F28F 7/00 (2006.01); H01L 23/34 (2006.01); H01L 23/427 (2006.01); H01L 23/473 (2006.01); F28D 15/02 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); G06F 2200/201 (2013.01); H01L 23/427 (2013.01); H01L 23/473 (2013.01); F28D 15/0266 (2013.01);
Abstract

A thermal module includes a centrifugal fan and a circuit board. The circuit board defines a through hole therein. The centrifugal fan includes a top plate located above the circuit board and aligned with the through hole, a first sidewall extending from a circumferential edge of the top plate toward the circuit board, a bottom plate located below the circuit board and aligned with the through hole, a second sidewall extending from a circumferential edge of the bottom plate toward the circuit board, and an impeller. The first sidewall abuts a top surface of the circuit board around the through hole. The second sidewall abuts a bottom surface of the circuit board around the through hole. The impeller is smaller than the through hole. The impeller extends through to be located in the through hole.


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