The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2013

Filed:

Mar. 23, 2010
Applicants:

Koichi Matsuno, Mie-gun, JP;

Yoshiaki Himeno, Yokkaichi, JP;

Inventors:

Koichi Matsuno, Mie-gun, JP;

Yoshiaki Himeno, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a semiconductor substrate, an insulating film formed above the semiconductor substrate, and a plurality of first buried wirings and a plurality of second buried wirings located in the insulating film at predetermined intervals alternately in a direction parallel to a surface of the semiconductor substrate. Each second buried wiring is formed so that a width between both side surfaces thereof is increased from a lower end toward an upper portion and at an upper surface the width is larger than a width at an upper surface of each first buried wiring.


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