The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2013

Filed:

May. 12, 2011
Applicants:

Sung-min Hwang, Seoul, KR;

Hansoo Kim, Suwon-si, KR;

Wonseok Cho, Suwon-si, KR;

Jaehoon Jang, Seongnam-si, KR;

Jae-joo Shim, Suwon-si, KR;

Inventors:

Sung-Min Hwang, Seoul, KR;

Hansoo Kim, Suwon-si, KR;

Wonseok Cho, Suwon-si, KR;

Jaehoon Jang, Seongnam-si, KR;

Jae-Joo Shim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes: a plurality of conductive patterns stacked on a substrate and spaced apart from each other and a pad pattern including a flat portion extending in a first direction parallel to the substrate from one end of any one of the plurality of conductive patterns, and a landing sidewall portion extending upward from a top surface of the flat portion, wherein a width of a portion of the landing sidewall portion in a second direction parallel to the substrate and perpendicular to the first direction is less than a width of the flat portion.


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