The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2013
Filed:
May. 06, 2011
Eiichi Satou, Hitachi, JP;
Shigeru Nobe, Hitachi, JP;
Munehiro Oota, Hitachi, JP;
Masayuki Hanano, Hitachi, JP;
Shigeru Yoshikawa, Hitachi, JP;
Eiichi Satou, Hitachi, JP;
Shigeru Nobe, Hitachi, JP;
Munehiro Oota, Hitachi, JP;
Masayuki Hanano, Hitachi, JP;
Shigeru Yoshikawa, Hitachi, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
The polishing solution for CMP of the invention comprises abrasive grains, a first additive and water, wherein the first additive is at least 1,2-benzoisothiazole-3(2H)-one or 2-aminothiazole. The polishing method of the invention is a polishing method for a substrate having a silicon oxide film on the surface, and the polishing method comprises a step of polishing the silicon oxide film with a polishing pad while supplying the polishing solution for CMP between the silicon oxide film and the polishing pad.