The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2013
Filed:
Dec. 11, 2009
Applicants:
Naoki Noda, Yamanashi, JP;
Toshio Yokouchi, Yamanashi, JP;
Masahiro Ishimori, Yamanashi, JP;
Inventors:
Assignees:
Pioneer Corporation, Kanagawa, JP;
Pioneer Micro Technology Corporation, Yamanashi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of bonding a semiconductor substrate has a step of pressurizing and heating to bond a substratewith a substrateby eutectic bonding in a state that an aluminum containing layerand a germanium layerbetween a bonding sectionof the substrateand a bonding sectionof the substrateare overlaid and an outer endof the germanium layeris receded inward with respect to an outer endof the aluminum containing layer