The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8592130 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 26, 2013

Filed:

May. 22, 2009
Applicants:

Masahiro Miyasaka, Hitachi, JP;

Yukiko Muramatsu, Hitachi, JP;

Inventors:

Masahiro Miyasaka, Hitachi, JP;

Yukiko Muramatsu, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 7/004 (2006.01); G03F 7/028 (2006.01); G03F 7/11 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A photosensitive resin composition comprising: (A) a binder polymer having a divalent group represented by formula (I), (II) and (III); (B) a photopolymerizing compound; and (C) a photopolymerization initiator. [In formulas (I), (II) and (III), R, R, Reach independently represents a hydrogen atom or a methyl group, Ris C1-C3 alkyl group, etc., m is an integer of 0-5, R, Rand Reach independently represents a hydrogen atom or a C1-C5 alkyl group, and at least two among R, Rand Rare C1-C5 alkyl groups.]


Find Patent Forward Citations

Miyasaka, Masahiro. (2013). Photosensitive resin composition, photosensitive element, method of forming resist pattern and method of producing printed wiring board (U.S. Patent No. 8592130). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8592130

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