The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2013
Filed:
Apr. 20, 2011
Roland Schuetz, Ottawa, CA;
Roland Schuetz, Ottawa, CA;
MOSAID Technologies Incorporated, Ottawa, Ontario, CA;
Abstract
A semiconductor device includes a substrate having a plurality of substrate bonding pads disposed on a bonding surface thereof. A plurality of semiconductor dice are stacked on the bonding surface of the substrate to form a die stack. Each die has a plurality of die bonding pads arranged along at least one bonding edge thereof. The remaining edges of each die are non-bonding edges. A plurality of bonding wires each electrically connects one of the die bonding pads to one of the substrate bonding pads. At least one thermally conductive layer is disposed between two adjacent semiconductor dice. At least one thermally conductive lateral portion is in thermal contact with the at least one layer of thermally conductive material. Each thermally conductive lateral portion is arranged along a non-bonding edge of the die stack.