The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2013

Filed:

Jul. 21, 2011
Applicants:

Hanshin Youn, Hwaseong-si, KR;

Yonghwan Kwon, Suwon-si, KR;

Younghoon RO, Hwaseong-si, KR;

Woojae Kim, Hwaseong-si, KR;

Sungwoo Park, Anyang-si, KR;

Inventors:

HanShin Youn, Hwaseong-si, KR;

Yonghwan Kwon, Suwon-si, KR;

YoungHoon Ro, Hwaseong-si, KR;

Woojae Kim, Hwaseong-si, KR;

Sungwoo Park, Anyang-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
Abstract

An example embodiment relates to a semiconductor package. The semiconductor package includes a first substrate including a first pad, a second substrate upwardly spaced apart from the first substrate and including a second pad opposite to the first pad. At least one electrode is coupled between the first pad and the second pad. The semiconductor package includes a guide ring formed at a periphery of the electrode between the first substrate and the second substrate.


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