The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2013

Filed:

Dec. 20, 2011
Applicants:

Fumihisa Miyasaka, Nagano, JP;

Junji Sato, Nagano, JP;

Inventors:

Fumihisa Miyasaka, Nagano, JP;

Junji Sato, Nagano, JP;

Assignee:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring board includes a stacked body having a plurality of insulating layers and a plurality of wiring layers which are alternately stacked, and a solder-resist layer being formed on one side of the stacked body and covering the wiring layer exposed to the one side of the stacked body. The insulating layer is exposed to the other side of the stacked body. The solder-resist layer is in a transparent or semitransparent light yellow color.


Find Patent Forward Citations

Miyasaka, Fumihisa. (2013). Wiring board and semiconductor package (U.S. Patent No. 8587104). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8587104

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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