The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8581976 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 12, 2013

Filed:

Jan. 07, 2011
Applicants:

Masaki Kurihara, Yokohama, JP;

Toshifumi Honda, Yokohama, JP;

Ryo Nakagaki, Kawasaki, JP;

Inventors:

Masaki Kurihara, Yokohama, JP;

Toshifumi Honda, Yokohama, JP;

Ryo Nakagaki, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 7/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and apparatus for reviewing defects of a semiconductor device is provided which involves detecting a defect on a SEM image taken at low magnification, and reviewing the defect on a SEM image taken at high magnification, and which can review a lot of defects in a short period of time thereby to improve the efficiency of defect review. In the present invention, the method for reviewing defects of a semiconductor device includes the steps of obtaining an image including a defect on the semiconductor device detected by a detection device by use of a scanning electron microscope at a first magnification, making a reference image from the image including the defect obtained at the first magnification, detecting the defect by comparing the image including the defect obtained at the first magnification to the reference image made from the image including the defect at the first magnification, and taking an image of the detected defect at a second magnification that is larger than the first magnification.


Find Patent Forward Citations

Kurihara, Masaki. (2013). Method and apparatus for reviewing defects of semiconductor device (U.S. Patent No. 8581976). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8581976

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