The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2013

Filed:

Oct. 31, 2008
Applicants:

Chiu-ming Chou, Kaohsiung, TW;

Mou-shiung Lin, Hsinchu, TW;

Inventors:

Chiu-Ming Chou, Kaohsiung, TW;

Mou-Shiung Lin, Hsinchu, TW;

Assignee:

Megit Acquistion Corp., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for fabricating multiple metal layers includes the following steps. An electronic component is provided with multiple contact points. A first metal layer is deposited over said electronic component. A first mask layer is deposited over said first metal layer. A second metal layer is deposited over said first metal layer exposed by an opening in said first mask layer. Said first mask layer is removed. A second mask layer is deposited over said second metal layer. A third metal layer is deposited over said second metal layer exposed by an opening in said second mask layer. Said second mask layer is removed. Said first metal layer not covered by said second metal layer is removed.


Find Patent Forward Citations

Chou, Chiu-Ming. (2013). Structure of gold bumps and gold conductors on one ic die and methods of manufacturing the structures (U.S. Patent No. 8581404). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8581404

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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