The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Aug. 09, 2011
Yoshikazu Oshika, Tokyo, JP;
Masayuki Nakano, Tokyo, JP;
Yoshikazu Oshika, Tokyo, JP;
Masayuki Nakano, Tokyo, JP;
Dowa Electronics Materials Co., Ltd., Tokyo, JP;
Abstract
A submount with an electrode layer having excellent wettability in soldering and method of manufacturing the same are disclosed. A submount () for having a semiconductor device mounted thereon comprises a submount substrate (), a substrate protective layer () formed on a surface of the submount substrate (), an electrode layer () formed on the substrate protective layer () and a solder layer () formed on the electrode layer () wherein the electrode layer () is made having an average surface roughness of less than 1 μm. The reduced average surface roughness of the electrode layer () improves wettability of the solder layer (), allowing the solder layer () and a semiconductor device to be firmly bonded together without any flux therebetween. A submount () is thus obtained which with the semiconductor device mounted thereon is reduced in heat resistance, reducing its temperature rise and improving its performance and service life.