The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Aug. 10, 2010
Kazuyuki Nakagawa, Kanagawa, JP;
Shinji Baba, Kanagawa, JP;
Satoshi Yamada, Kanagawa, JP;
Takashi Karashima, Kanagawa, JP;
Kazuyuki Nakagawa, Kanagawa, JP;
Shinji Baba, Kanagawa, JP;
Satoshi Yamada, Kanagawa, JP;
Takashi Karashima, Kanagawa, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
To aim at improvement of reliability of a semiconductor device of flip chip connection type. In assembling a BGA of flip chip connection type, when a semiconductor chip is solder-connected by a flip chip connection, because solder precoat is formed on the surface of a land on the side of an undersurface of a wiring substrate, the connection between the land and a solder ball, which is an external terminal, is solder-connection, and therefore, it is possible to increase impact resistance of a connection part between the land and the solder ball and to aim at improvement of reliability of the BGA.