The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Nov. 09, 2005
Edward Fuergut, Dasing, DE;
Hermann Vilsmeier, Höhenkirchen, DE;
Simon Jerebic, Regensburg, DE;
Michael Bauer, Nittendorf, DE;
Edward Fuergut, Dasing, DE;
Hermann Vilsmeier, Höhenkirchen, DE;
Simon Jerebic, Regensburg, DE;
Michael Bauer, Nittendorf, DE;
Other;
Abstract
The invention relates to a method for making a semiconductor. In one embodiment the method includes applying an adhesive layer to ground-thin or thinned semiconductor chips of a semiconductor wafer. In this embodiment, the adhesive layer composed of curable adhesive is introduced relatively early into a method for the thinning by grinding, separation and singulation of a semiconductor wafer to form thinned semiconductor chips, and is used further in a semiconductor device into which the thinned semiconductor chip is to be incorporated.