The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Nov. 24, 2009
Jeffrey Drue David, San Jose, CA (US);
Harry Q. Lee, Los Altos, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Dominic J. Benvegnu, La Honda, CA (US);
Zhize Zhu, Cupertino, CA (US);
Wen-chiang Tu, Mountain View, CA (US);
Jeffrey Drue David, San Jose, CA (US);
Harry Q. Lee, Los Altos, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Dominic J. Benvegnu, La Honda, CA (US);
Zhize Zhu, Cupertino, CA (US);
Wen-Chiang Tu, Mountain View, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method includes polishing a substrate on a first platen using a first set of parameters, obtaining a plurality of measured spectra from at least two zones, comparing the plurality of measured spectra with a reference spectrum to evaluate the thickness of each of the at least two zones of the substrate, comparing a thickness of a first zone with a thickness of a second zone, determining whether the thickness of the first zone falls within a predetermined range of the thickness of the second zone, and if the thickness does not fall within the predetermined range, at least one of a) adjusting at least one parameter of the first set and polishing a second substrate on the first platen using the adjusted parameters, or b) adjusting at least one parameter of a second set and polishing the substrate on a second platen using the adjusted parameters.