The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2013
Filed:
Sep. 22, 2011
Shigetsugu Muramatsu, Nagano, JP;
Satoshi Sunohara, Nagano, JP;
Shigetsugu Muramatsu, Nagano, JP;
Satoshi Sunohara, Nagano, JP;
Abstract
A wiring substrate includes a wiring pattern, which includes an upper surface forming a desired recognition mark, and a solder resist layer, which covers the wiring pattern. The solder resist layer includes a recess that entirely exposes the upper surface of the wiring pattern. The solder resist layer includes a solder resist layer formed at a region corresponding to the recess and a solder resist layer formed outside the recess. The recess entirely exposes the upper surface of the wiring pattern as the recognition mark, and the solder resist layer is formed at portions outside the upper surface of the wiring pattern.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile