The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8573794 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 05, 2013

Filed:

Mar. 07, 2011
Applicants:

Hung-chih Lin, Hsinchu, TW;

Yi-wen Lin, Hsinchu, TW;

Inventors:

Hung-Chih Lin, Hsinchu, TW;

Yi-Wen Lin, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/13357 (2006.01); G09F 13/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A backlight module includes a heat-dissipating element, at least one light-emitting element disposed on a first side of the heat-dissipating element, a back plate, and a heat-insulation element. The back plate has at least one opening and is disposed on the first side of the heat-dissipating element, and the back plate is not overlapped with the light-emitting element. The heat-insulation element is disposed between the back plate and the heat-dissipating element for reducing heat conduction between the back plate and the heat-dissipating element so as to prevent the heat generated by the light-emitting element from being conducted to the back plate.


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Lin, Hung-Chih. (2013). Backlight module (U.S. Patent No. 8573794). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8573794

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