The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2013

Filed:

Jul. 15, 2013
Applicant:

Orthodyne Electronics Corporation, Irvine, CA (US);

Inventors:

Christoph B. Luechinger, Irvine, CA (US);

Orlando L. Valentin, Rancho Santa Margarita, CA (US);

Tao Xu, Irvine, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/10 (2006.01); B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.


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