The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2013
Filed:
Oct. 05, 2009
Kentaro Mori, Tokyo, JP;
Daisuke Ohshima, Tokyo, JP;
Shintaro Yamamichi, Tokyo, JP;
Hideya Murai, Tokyo, JP;
Katsumi Maeda, Tokyo, JP;
Katsumi Kikuchi, Tokyo, JP;
Yoshiki Nakashima, Tokyo, JP;
Kentaro Mori, Tokyo, JP;
Daisuke Ohshima, Tokyo, JP;
Shintaro Yamamichi, Tokyo, JP;
Hideya Murai, Tokyo, JP;
Katsumi Maeda, Tokyo, JP;
Katsumi Kikuchi, Tokyo, JP;
Yoshiki Nakashima, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A semiconductor device includes: at least one semiconductor element having electrode terminals; a metal plate supporting the semiconductor element; and a wiring board covering the semiconductor element and including a plurality of insulating layers and wiring layers alternately stacked and external connection terminals on a surface, the wiring layers being electrically connected to each other by vias. The electrode terminals and the external connection terminals are electrically connected via at least one of the wiring layers and the vias. At least one of the electrode terminals, the is wiring layers, and the vias is electrically connected to the metal plate.