The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2013
Filed:
Sep. 27, 2011
Applicant:
Cheng-yi Weng, Kaohsiung, TW;
Inventor:
Cheng-Yi Weng, Kaohsiung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present stacked semiconductor packages include a bottom package and a top package. The bottom package includes a substrate, a solder mask layer, a plurality of conductive pillars and a die electrically connected to the substrate. The solder mask layer has a plurality of openings exposing a plurality of pads on the substrate. The conductive pillars are disposed on at least a portion of the pads, and protrude from the solder mask layer.