The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2013

Filed:

Jun. 17, 2011
Applicant:

Stephan Six, Aalen, DE;

Inventor:

Stephan Six, Aalen, DE;

Assignee:

Carl Zeiss SMT GmbH, Oberkochen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02N 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wafer chuck () having a substrate () and having, applied to the substrate (), an electrically conductive coating () for fixing a wafer () by electrostatic attraction and preferably having a reflective coating () applied to the substrate (). The coating () has at least a first layer () under compressive stress and at least a second layer () under tensile stress for compensating for the compressive stress of the first layer () in order to keep deformation of the wafer chuck () by the coating () as low as possible.


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