The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2013
Filed:
Mar. 08, 2010
Jong-won Han, Cheonan-si, KR;
Seok Goh, Cheonan-si, KR;
Byoung-jun Min, Asan-si, KR;
Jung-hyeon Kim, Hwaseong-si, KR;
Sang-sik Lee, Suwon-si, KR;
Bo-woo Kim, Suwon-si, KR;
Ho-jeong Choi, Yongin-si, KR;
Jong-Won Han, Cheonan-si, KR;
Seok Goh, Cheonan-si, KR;
Byoung-Jun Min, Asan-si, KR;
Jung-Hyeon Kim, Hwaseong-si, KR;
Sang-Sik Lee, Suwon-si, KR;
Bo-Woo Kim, Suwon-si, KR;
Ho-Jeong Choi, Yongin-si, KR;
SAMSUNG Electronics Co., Ltd., Suwon-si, KR;
Abstract
A test socket is provided that includes a socket body to receive an object to be tested, a lid disposed on the socket body, one or more pushers coupled to a first surface of lid to apply force to a first surface of the object toward the socket body, and a temperature controlling member to provide a temperature to the object. A semiconductor package may be tested in a test apparatus that includes the test socket, the methods of testing including receiving a semiconductor package in a socket in a test chamber, applying a first temperature to the test chamber to test the semiconductor package at a first test temperature, and applying a second temperature to the semiconductor package to test the semiconductor package at a second test temperature by controlling the application of the second temperature with the socket.