The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2013
Filed:
Mar. 23, 2010
Applicant:
Robert Lanzone, Chandler, AZ (US);
Inventor:
Robert Lanzone, Chandler, AZ (US);
Assignee:
Amkor Technology, Inc., Chandler, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/495 (2006.01); H01L 23/34 (2006.01); H01L 29/80 (2006.01); H01L 31/112 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention is directed to a semiconductor packaging solution wherein a high K thermal material such as a grease or gel is placed in a controlled thin bond line between the semiconductor die of the package and a heat sink in a direct manner using a thermal tape window frame as a low cost mechanical attachment mechanism. As the main thermal dissipation path is between the backside of the semiconductor die and the heat sink, a high K TIM material can be used to maximize thermal dissipation in a manner that does not require expensive mechanical attachment methods.