The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2013
Filed:
Aug. 17, 2006
Youichirou Kaga, Saitama, JP;
Hisayuki Imamura, Saitama, JP;
Junichi Watanabe, Saitama, JP;
Hitachi Metals, Ltd., Tokyo, JP;
Abstract
A circuit board and a semiconductor module with high endurance against thermal cycles, and which is hard to be broken under thermal cycles, even if thick metal circuit board and thick metal heat sink are used, corresponding to high power operation of a semiconductor chip are provided. This circuit board includes, an insulating-ceramic substrate, a metal circuit plate bonded to one face of the insulating-ceramic substrate, a metal heat sink bonded to another face of the insulating-ceramic substrate, wherein (t−t)/t/K<1.5, where, a thickness of the insulating ceramics substrate is t, a thickness of the metal circuit plate is t, a thickness of the metal heat sink is t, and an internal fracture toughness value of the insulating ceramics substrate is K.