The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2013

Filed:

Nov. 16, 2010
Applicants:

Chung Foong Tan, Singapore, SG;

Eng Huat Toh, Singapore, SG;

Jae Gon Lee, Daegu, KR;

Chunshan Yin, Singapore, SG;

Lakshmi Bera, Singapore, SG;

Inventors:

Chung Foong Tan, Singapore, SG;

Eng Huat Toh, Singapore, SG;

Jae Gon Lee, Daegu, KR;

Chunshan Yin, Singapore, SG;

Lakshmi Bera, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing an integrated circuit system includes: providing a substrate having a channel region; forming a gate stack over a portion of the channel region with the gate stack having a floating gate for storing an electrical charge; forming a source recess in the substrate adjacent to the gate stack; and forming a source by layering a first bandgap material in the source recess.


Find Patent Forward Citations

Quick Actions:

Tan, Chung. (2013). Integrated circuit system with bandgap material and method of manufacture thereof (U.S. Patent No. 8563386). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8563386

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