The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2013

Filed:

Nov. 12, 2010
Applicants:

Satoru Kawai, Ogaki, JP;

Yasuki Kimishima, Ogaki, JP;

Inventors:

Satoru Kawai, Ogaki, JP;

Yasuki Kimishima, Ogaki, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A printed wiring board including a substrate having first and second surfaces and a penetrating hole extending through the substrate between the surfaces, a first conductive circuit on the first surface, a second conductive circuit on the second surface, and a through-hole conductor in the hole and connecting the first and second conductive circuits. The conductor includes an electroless plated film on the inner-wall surface of the hole, a first electrolytic plated film formed on the electroless plated film and forming a first opening portion opening on the first surface and a second opening portion opening on the second surface, a second electrolytic plated film filling the first portion, and a third electrolytic plated film filling the second portion. The first and second portions taper toward the central portion of the hole with respect to the axis direction of the hole and have cross sections forming a substantially U-shape, respectively.


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