The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2013
Filed:
Apr. 30, 2009
Adrian Boyle, Knavinstown, IE;
Joseph Callaghan, Dublin, IE;
Fintan Mckiernan, Carrick on Shannon, IE;
Adrian Boyle, Knavinstown, IE;
Joseph Callaghan, Dublin, IE;
Fintan McKiernan, Carrick on Shannon, IE;
Electro Scientific Industries, Inc., Portland, OR (US);
Abstract
A method of dicing a semiconductor wafer comprises scribing at least one dielectric layer along dice lanes to remove material from a surface of the wafer using a laser with a pulse-width between 1 picosecond and 1000 picoseconds and with a repetition frequency corresponding to times between pulses shorter than a thermal relaxation time of the material to be scribed. The wafer is then diced through a metal layer and at least partially through a substrate of the semiconductor wafer.