The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2013

Filed:

Feb. 19, 2010
Applicants:

Nicholas Jason Ackerley, Kanata, CA;

Timothy Philip Setterfield, Ottawa, CA;

Mark Jonathan Brice Hayman, Dunrobin, CA;

Inventors:
Assignee:

Nanometrics Inc., Kanata, Ontario, CA;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01P 15/00 (2006.01); G01P 15/125 (2006.01);
U.S. Cl.
CPC ...
Abstract

A broadband weak-motion inertial sensor includes a frame, a movable inertial mass, a forcing transducer for keeping the inertial mass stationary relative to the frame during operation, and a flexure for suspending the movable mass in the frame. Two or more closely spaced, substantially parallel capacitor plates, at least one attached to the frame, and one attached to the movable inertial mass, form a capacitive displacement transducer. The capacitor plates have a plurality of apertures with dimensions and arrangement chosen to simultaneously minimize damping induced thermal noise and give a high spatial efficiency. In an implementation, three capacitor plates are provided. The capacitor plates each have a same hexagonal pattern of circular holes; the holes are aligned on all included capacitor plates. Radius and spacing of the holes are dictated by a relationship that determines the minimum damping per unit capacitively effective area for a desired spatial efficiency, gap height and capacitor plate thickness. In an implementation, the capacitor plates are made of a printed circuit board material which, through etching of the thin conductive layer, can be mounted directly to a conductive frame and conductive inertial mass without the use of non-conductive spacers.


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