The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2013

Filed:

May. 18, 2011
Applicants:

Wei-i Lee, Hsinchu, TW;

Kuei-ming Chen, New Taipei, TW;

Yin-hao Wu, Taichung, TW;

Yen-hsien Yeh, New Taipei, TW;

Inventors:

Wei-I Lee, Hsinchu, TW;

Kuei-Ming Chen, New Taipei, TW;

Yin-Hao Wu, Taichung, TW;

Yen-Hsien Yeh, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/461 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention discloses a smoothing method to decrease bowing of group III nitride semiconductor substrate. The certain face of group III nitride semiconductor substrates is etched under the appropriate etching recipe and time, the certain morphology such as rod-type and other structures are appeared at the certain face. And such structures releases the compressive stresses at these certain faces, resulting in clearly increasing the bowing radius of the group III nitride semiconductor substrates, finally decreasing the bowing phenomenon of the group III nitride semiconductor substrate.


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