The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2013
Filed:
Mar. 10, 2011
Nobuyuki Aoyagi, Tokyo, JP;
Hiroaki Yoshino, Tokyo, JP;
Nobuyuki Aoyagi, Tokyo, JP;
Hiroaki Yoshino, Tokyo, JP;
Shinkawa Ltd., Tokyo, JP;
Abstract
Provided is a bonding apparatus capable of forming even loops at high speed. According to a bonding apparatus, a capillaryis lowered to a bonding position to bond an initial ballto a padon an overhanging die. Here, a position of the capillaryin a Z direction and a load detected by a load sensorare detected and stored every predetermined time period. A load change point is detected by referring to the stored load and the stored position. By subtracting the bonding position from a load changing position of the capillaryat the load change point, a movement amount Z of the capillaryfrom the load changing position to the bonding position is calculated. After the capillaryis lifted by the movement amount Z, a wire loop is formed between the padand a lead